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Bluetooth®Mesh
Introduced in 2017, Bluetooth® Mesh extends the capabilities of Bluetooth® Low Energy (LE) to enable large-scale, multi-device networks and extended range via multi-hop messaging. As a pioneer in Bluetooth® Mesh innovation, Telink has been delivering both proprietary and standards-based mesh connectivity solutions since 2015, empowering leading global manufacturers to deploy scalable, energy-efficient IoT systems across applications like smart lighting, asset tracking, and industrial automation.
TLSR827x Series
The TLSR827x Series supports Bluetooth® Low Energy (LE), Bluetooth® Mesh, Zigbee, RF4CE, Apple HomeKit, Apple Find My network, and 2.4GHz proprietary protocols in a single chip. It integrates RF inductors to help to reduce the Bill of Materials (BOM). Audio functionality is enhanced with a wider supply voltage range. In addition, it has a reserved Wi-Fi PTA hardware interface is reserved, which further improves DCDC efficiency and reduces system power consumption.
| Part Number |
Datasheet |
Bluetooth® Protocol |
MCU | SRAM | Flash | GPIO |
Package Size |
Test Report |
| TLSR8278F1KET48 | .svg){kind=small} |
Bluetooth® 5.4 | T-MCU 32-bit | 64KB | 1MB | 32 | QFN 7x7, 48 pins | |
|
TLSR8277F512EL40 |
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Bluetooth® 5.4 | T-MCU 32-bit | 64KB | 512KB | 25 | LGA 4x6, 40 pins | |
|
TLSR8273F512ET48 |
 |
Bluetooth® 5.4 | T-MCU 32-bit | 64KB | 512KB | 32 | QFN 7x7, 48 pins | |
| TLSR8273F512ET32 | |
Bluetooth® 5.4 | T-MCU 32-bit | 64KB | 512KB | 12 | QFN 4x4, 32 pins | Reliability |
| TLSR8273F512GT32 | |
Bluetooth® 5.4 | T-MCU 32-bit | 64KB | 512KB | 19 | TQFN 5x5, 32 pins | Reliability |
| TLSR8271F512ET32 | |
Bluetooth® 5.4 | T-MCU 32-bit | 32KB | 512KB | 19 | QFN 5x5, 32 pins | Reliability |
| TLSR8270F512ET48 | |
Bluetooth® 5.4 | T-MCU 32-bit | 32KB | 512KB | 32 | QFN 7x7, 48 pins | Reliability |
Software
Hardware
Software
Telink provides a complete SDK to help you develop and build IoT smart devices, which covers your entire product life cycle, from development to OTA maintenance. The Telink SDK always includes the latest technology protocols and provides secure and stable connectivity, which, combined with Telink IoT Studio integrated development tools, can help quickly achieve mass production.
| SDK Name |
Supported Chip |
SDK Version |
Download SDK |
SDK Handbook |
| Bluetooth® LE Single Connection | TLSR8278/8273/8271 | V3.4.2.6 | Github | |
| Bluetooth® LE Multi Connection | TLSR8278/8273 | V4.0.2.1 | Github | |
| Bluetooth® Mesh | TLSR8278/8273 | V4.1.0.1 | Github | |
| 2.4G Proprietary | TLSR8278/8273/8271 | V3.4.4 | Github | |
| RF4CE | TLSR8278/8273 | V2.4.2.0 | Github | |
| Zigbee | TLSR8278 | V3.7.1.2_Patch_0001 | Github | |
| 802.15.4 | TLSR8278/8273/8271 | V1.3.0.3 | Github | |
| Platform | TLSR8278/8273/8271 | V3.1.0 | Github | |
Hardware
Provide complete hardware guideline and reference design to build various device forms based on the Telink hardware development platform.
| Picture | Product Name | Description | User Manual | Reference Design | Buy Now |
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TLSR8278 Development Board | The TLSR8278 development board is designed based on the TLSR8278F1KET48 chip. It can be used to verify the TLSR827x series chips and the TLSR8355 chip. It supports various functional tests, such as RF conducted testing, current testing, audio input and output testing, and any combination of lights and buttons. |
Download | Download |  |
