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 Telink SoC chips support the Bluetooth Classic protocol and are widely used in data transmission and audio streaming applications.

 Telink Bluetooth LE chips and SDKs are compliant with the latest version of Bluetooth standards and features to meet customers' low power requirements.

 Telink has been supplying proprietary and standard Bluetooth Mesh connectivity into the hands of some of the world's largest device-makers since as early as 2015.

 Telink’s dual-mode chip offers the choice of both Bluetooth Classic and Bluetooth LE audio, allowing for a seamless technology transition on the same product.

Telink’s multi-protocol SoCs and concurrent SDK enables direct smart phone access to the Zigbee network via Bluetooth LE, which is critical to a better user experience.

Certified by Thread standard, Telink's SoCs can help customers quickly develop IoT smart devices that comply with both the Thread protocol and Matter standards.

Telink SoC chips are now certified by Thread and OpenThread.

Highly integrated 1T1R WiFi 6 and Bluetooth LE 5.1+IEEE 802.15.4 multi-standard wireless protocols for ultra-low power and low cost IoT applications.

The ease of designing and manufacturing products based on Telink 2.4GHz SoCs and reference designs enables developers to accelerate their time-to-market.